During her visit, Lisa Su intends to talk about potential future collaboration with TSMC’s CEO, CC Wei. The use of TSMC’s “N3 Plus” fabrication node (likely N3P) and N2 (2nm-class) production technology is one of the subjects, according to sources with knowledge of the situation, according to DigiTimes. The chief executives of the two companies will also talk about plans for new orders, including technology that are either already accessible or will be in the near future. The remarkable success that AMD has experienced recently is largely due to TSMC’s capacity to manufacture chips in large quantities utilising its fiercely competitive process technology. AMD must assure adequate allocation at TSMC and early access to the foundry’s most recent process design kits if it is to continue its streak of roaring success. It is about time for AMD to start discussing the use of N2 for its 2026 products and beyond since TSMC will begin volume chip production on its N2 node sometime in the second half of 2025. Future success of AMD will be dependent on modern chip packing technologies as well as advanced TSMC semiconductor manufacturing technologies since the company will heavily rely on multi-chiplet chip packaging technologies. Along with discussing longer-term plans, AMD’s C-level executives will also talk about more practical issues like the availability of sophisticated printed circuit boards (PCBs) for its CPUs, which is one of the things limiting AMD server CPU shipments, as well as the presence of Ajinomoto build-up films (ABF) for these PCBs. The executives of AMD will also meet with ASMedia, which creates chipsets for the red firm, and Asus and Acer, two sizable Taiwanese PC manufacturers with strong ties to the American chip designers.
